Patrick W. DeHaven
24Patents
10h-index
61Co-inventors
78Inventor score
Filing activity: Jan 8, 1991 → Jul 31, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6123825A | Electromigration-resistant copper microstructure and process of making | Emerging Cross-Sectional Technologies | 60 | Expired |
| US6291885A | Thin metal barrier for electrical interconnections | Electricity | 42 | Expired |
| US6333120A | Method for controlling the texture and microstructure of plated copper and plated structure | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6437440B1 | Thin film metal barrier for electrical interconnections | Electricity | 33 | Expired |
| US5171642A | Multilayered intermetallic connection for semiconductor devices | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6126761A | Process of controlling grain growth in metal films | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5943601A | Process for fabricating a metallization structure | Electricity | 16 | Expired |
| US7407875B2 | Low resistance contact structure and fabrication thereof | Electricity | 13 | Active |
| US9224675B1 | Automatic capacitance tuning for robust middle of the line contact and silicide applications | Electricity | 11 | Active |
| US7105360B2 | Low temperature melt-processing of organic-inorganic hybrid | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6916729B2 | Salicide formation method | Electricity | 8 | Expired |
| US6572982B1 | Electromigration-resistant copper microstructure | Emerging Cross-Sectional Technologies | 8 | Expired |
| US8574953B2 | Low temperature melt-processing of organic-inorganic hybrid | Emerging Cross-Sectional Technologies | 4 | Active |
| US7951708B2 | Copper interconnect structure with amorphous tantalum iridium diffusion barrier | Emerging Cross-Sectional Technologies | 4 | Active |
| US6792075B2 | Method and apparatus for thin film thickness mapping | Physics | 2 | Expired |
| US6509265B1 | Process for manufacturing a contact barrier | Electricity | 2 | Expired |
| US6638374B2 | Device produced by a process of controlling grain growth in metal films | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6361627B1 | Process of controlling grain growth in metal films | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6909772B2 | Method and apparatus for thin film thickness mapping | Physics | 1 | Expired |
| US8123997B2 | Low temperature melt-processing of organic-inorganic hybrid | Emerging Cross-Sectional Technologies | 0 | Active |
| US7223691B2 | Method of forming low resistance and reliable via in inter-level dielectric interconnect | Electricity | 0 | Expired |
| US6180521A | Process for manufacturing a contact barrier | Electricity | 0 | Expired |
| US7291516B2 | Low temperature melt-processing of organic-inorganic hybrid | Emerging Cross-Sectional Technologies | 0 | Active |
| US7456045B2 | Low temperature melt-processing of organic-inorganic hybrid | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.