Patent · US Expired

Step and flash imprint lithography

US6334960B1 · kind B1 · utility

458Cited by
12References
34Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 11, 1999
Grant dateJan 1, 2002
Priority date
Expiry dateMar 11, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S977/897
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.