Method of fabricating an interconnection element
US6336269B1 · kind B1 · utility
312Cited by
40References
23Claims
0Family size
Inventors
Key dates
| Filing date | May 26, 1995 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Aug 4, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, generally in the form of certain raised features. These are formed by embossing depressed features into the sacrificial substrate upon which the contact tip structure is constructed. The contact tip structure can be optimized for making contact with another electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.