Method for transferring wafers in a semiconductor tape-peeling apparatus
US6336787B1 · kind B1 · utility
9Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2000 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Apr 17, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer method using a robot arm for sucking the front-side of the uppermost one of a plurality of wafers stored in a cassette, and for transferring the wafer having a tape adhered to the front-side thereof to a semiconductor tape-peeling device for tape-peeling. Although the wafer warps, the undesired effect that the robot arm crashes any of the wafers can be avoided by using this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.