In line yield prediction using ADC determined kill ratios die health statistics and die stacking
US6338001B1 · kind B1 · utility
21Cited by
6References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 22, 1999 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Feb 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing and inspecting semiconductor devices wherein defects on inspection wafers are tabulated in a stacked defect table wherein a defect table for each layer is generated per die number and a calculated cumulative die health statistic using an automatic defect classification system and a kill ratio for each defect. The cumulative die health statistic is carried over to the next defect table generated for the next layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.