Electronic device package and leadframe
US6339252B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 13, 2000 |
| Grant date | Jan 15, 2002 |
| Priority date | — |
| Expiry date | Jun 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. In one embodiment, the package includes an integrated circuit device on a metal die pad. A metal ring is between the die pad and leads and surrounds the die pad. The ring is connected to the die pad by a nonconductive adhesive tape. Encapsulant material covers the entire structure, except for portions of the leads. The ring is electrically connected to a lead identified for connection to an external power voltage supply. The ring in turn is electrically connected to a power voltage input pad on the integrated circuit device. The potential of the die pad may float, or the die pad may be electrically connected through a lead to an external ground voltage. The package is made from a leadframe that has a die pad, a metal ring between the die pad and radiating leads, and a nonconductive adhesive tape that connects the ring to the die pad. A bypass capacitor may be electrically connected between the die pad and ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.