Flip chip on glass image sensor package fabrication method
US6342406B1 · kind B1 · utility
83Cited by
34References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2000 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Nov 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electrically conductive interior traces and exterior traces are formed on interior and exterior surfaces, respectively, of a window. The interior traces are electrically connected to the exterior traces by electrically conductive vias extending through the window. To mount the window to an image sensor, the interior traces are aligned with bond pads on a front surface of the image sensor. Flip chip bumps are formed between the interior traces and the bond pads thus mounting the window to the image sensor. A sealer is applied to form a seal between the window and the image sensor and to protect an active area of the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.