Integrated circuit having air gaps between dielectric and conducting lines
US6342722B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1999 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Aug 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit and method of making the integrated circuit. Air gaps are formed between surfaces of current-conducting lines that face one another and dielectric material disposed between these surfaces of the current-conducting lines. A liner material is applied to these surfaces of the current-conducting lines and, after the dielectric material is introduced between the current-conducting lines, the liner material is removed, for example by etching, leaving air gaps between the current-conducting lines and the dielectric material. These air gaps eliminate or greatly reduce the effect of capacitive currents across the dielectric material between the current-conducting lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.