Method of manufacturing solder bumps and solder joints using formic acid
US6344407B1 · kind B1 · utility
35Cited by
8References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2000 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Oct 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor device manufacturing method comprises the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing formic acid to form the solder bumps. Accordingly, the solder bumps can be formed without flux generating voids in the solder layer. Furthermore, the cleaning required after the solder bumps are formed can be omitted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.