Chip-scale packaged pressure sensor
US6346742B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1998 |
| Grant date | Feb 12, 2002 |
| Priority date | — |
| Expiry date | Nov 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A chip-scale sensor package is described. In one embodiment, the chip-scale sensor package includes a semiconductor substrate having a sensor region, and a semiconductor cap having a recess. The semiconductor cap is bonded to the semiconductor substrate with a thermocompression bond to form a cavity therebetween. The semiconductor substrate is bonded to the semiconductor cap using different types of materials. The semiconductor substrate and/or the semiconductor cap may optionally include a semiconductor device such as an electronically trimmable integrated circuit fabricated thereon. In addition, the semiconductor substrate may optionally include an integral stress isolation flexible region for isolation of the sensor region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.