Process and apparatus to adjust exposure dose in lithography systems
US6346979B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1999 |
| Grant date | Feb 12, 2002 |
| Priority date | — |
| Expiry date | Mar 17, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70558
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process and apparatus for dynamically adjusting the exposure dose on a photosensitive coating at a localized area within an exposure field in a step-and-scan lithography system. The process and apparatus form a pattern on a photosensitive substrate, such as used in the integrated circuit manufacturing industry. The exposure dose is adjusted at a localized area by a segmented slit system or an array of light-transmitting pixels located across the exposure field. The slit segments or individual pixels are automatically controlled in response to data obtained regarding the uniformity of the projection optics system or the mask pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.