Sacrificial bond pads for laser configured integrated circuits
US6348742B1 · kind B1 · utility
23Cited by
17References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 25, 1999 |
| Grant date | Feb 19, 2002 |
| Priority date | — |
| Expiry date | Jan 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond pad structure is provided which has a primary bond pad region electrically connected to a secondary bond pad region. The secondary bond pad region is used to test a circuit for configuration, while the primary bond pad is covered with a protective oxide. After configuration and etching to complete desired disconnections, the oxide is removed from the primary bond pad region, leaving an undamaged surface for subsequent wire bonding. The primary bond pad region and the secondary bond pad region can be a unitary structure or two separate structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.