John MacPherson
20Patents
10h-index
13Co-inventors
68Inventor score
Filing activity: Nov 29, 1988 → Nov 28, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5885749A | Method of customizing integrated circuits by selective secondary deposition of layer interconnect material | Electricity | 255 | Expired |
| US5223154A | System for filtering liquids in a catch basin using filters in series and overflow channels | Fixed Constructions | 88 | Expired |
| US5017394A | Method for making edible base shapes having pictorial images for decorating foodstuffs | Human Necessities | 62 | Expired |
| US6311316A | Designing integrated circuit gate arrays using programmable logic device bitstreams | Physics | 55 | Expired |
| US6749748B1 | Methods for reducing the amount of contaminants in water | Chemistry; Metallurgy | 24 | Expired |
| US6348742B1 | Sacrificial bond pads for laser configured integrated circuits | Electricity | 23 | Expired |
| US6078091A | Inter-conductive layer fuse for integrated circuits | Electricity | 17 | Expired |
| US6821427B2 | Methods for reducing the amount of contaminants in water | Chemistry; Metallurgy | 14 | Expired |
| US6060330A | Method of customizing integrated circuits by selective secondary deposition of interconnect material | Electricity | 11 | Expired |
| US6486527B1 | Vertical fuse structure for integrated circuits containing an exposure window in the layer over the fuse structure to facilitate programming thereafter | Electricity | 10 | Expired |
| US5985518A | Method of customizing integrated circuits using standard masks and targeting energy beams | Electricity | 9 | Expired |
| US6096566A | Inter-conductive layer fuse for integrated circuits | Electricity | 8 | Expired |
| US5945238A | Method of making a reusable photolithography mask | Physics | 8 | Expired |
| US6020648A | Die structure using microspheres as a stress buffer for integrated circuit prototypes | Electricity | 7 | Expired |
| US5989783A | Method of customizing integrated circuits by depositing two resist layers to selectively pattern layer interconnect material | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6369437B1 | Vertical fuse structure for integrated circuits and a method of disconnecting the same | Electricity | 5 | Expired |
| US6235556A | Method of improving parallelism of a die to package using a modified lead frame | Electricity | 3 | Expired |
| US6239480A | Modified lead frame for improved parallelism of a die to package | Electricity | 3 | Expired |
| US6087200A | Using microspheres as a stress buffer for integrated circuit prototypes | Electricity | 1 | Expired |
| US7749391B2 | Coagulant-enhanced pre-filtration system | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.