Power distribution printed circuit board for a semiconductor processing system
US6350964B1 · kind B1 · utility
23Cited by
7References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2000 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Nov 9, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor processing system including a printed circuit board structure for delivering power to an assembly of radiant energy sources. The printed circuit board structure, in one configuration, forms an evacuable housing for the assembly of radiant energy sources.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.