Ryan Boas
5Patents
4h-index
17Co-inventors
54Inventor score
Filing activity: Jul 8, 1999 → May 11, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6215106A | Thermally processing a substrate | Chemistry; Metallurgy | 44 | Expired |
| US6350964B1 | Power distribution printed circuit board for a semiconductor processing system | Electricity | 23 | Expired |
| US6897131B2 | Advances in spike anneal processes for ultra shallow junctions | Electricity | 18 | Expired |
| US6803546B1 | Thermally processing a substrate | Electricity | 12 | Expired |
| US11456205B2 | Methods for variable etch depths | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.