Method for making punches using multi-layer ceramic technology
US6352014B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1999 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Dec 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9423
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making small punches by employing multi-layer ceramic (MLC) technology includes the steps of preparing a sublaminate matrix of a high or low sintering temperature material, drilling holes in the sublaminate using a mask as a guide, filling the holes with punch material paste by a solupor process, laminating the sublaminate to a base plate or as a freestanding substrate, firing a laminate at an appropriate sintering temperature and removing the matrix material by a chemical or mechanical method. In accordance with the present invention, a large number of small punches are made in parallel to precise dimensions of two to ten mils in diameter and approximately 100 mils in length. This method allows that a punch plate array can also be used to simultaneously punch an array of vias in a greensheet and eliminates the additional step of loading individual punches into a punch plate, offering cost and time savings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.