Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
US6352466B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 31, 1998 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Aug 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.