Apparatus and method for in-situ measurement of polishing pad thickness loss
US6354910B1 · kind B1 · utility
4Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2000 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Jan 31, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A non-destructive method for measuring the thickness loss of a polishing pad due to pad conditioning includes the use of rigid planar members placed on the surfaces of both the conditioned and non-conditioned sections of the polishing pad. Measurements are made using measurement instruments which overhang the depressed conditioned section and measure the height difference between the upper surfaces of the planar members. The measurement instruments may be repositioned and measurements repeated to obtain an average thickness loss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.