Method for cleaning integrated circuit bonding pads
US6355576B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1999 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Apr 26, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/974
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for cleaning bonding pads on a semiconductor device, as disclosed herein, includes treating the bonding pads with a CF4 and water vapor combination. In the process, the water vapor breaks up and the hydrogen from the water vapor couples to fluorine residue on the bonding pad surface creating a volatile HF vapor. In addition, fluorine from the CF4 exchanges with the titanium in the metallic polymer residue making the polymer more soluble for the organic strip operation which follows. Next, the resist is ashed and then an organic resist stripper is applied to the bonding pad area, thereby creating a clean bonding pad surface. Thereafter, a reliable bond wire connection can be made to the bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.