Electronic package having flip chip integrated circuit and passive chip component
US6356453B1 · kind B1 · utility
45Cited by
16References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Jun 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/284
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package includes both a flip chip mounted active Chip component and a passive chip component. The flip chip bumps between the bond pads of the active chip component and the substrate are low impedance. Further, by mounting the active chip component as a flip chip, the area on the substrate occupied by the active chip component is approximately equal to the area of the active chip component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.