Thermal cycling module
US6359264B1 · kind B1 · utility
57Cited by
12References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1998 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Mar 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal cycling module for thermally processing a substrate has a thermally-conductive support structure with a planar first side and a second side with a plurality of recesses. A heater is disposed on the first side of the support structure and a fluid distributor positioned beneath the second side of the support structure to direct a coolant onto the support structure to decrease the temperature of the substrate. The fluid distributor may have a plurality of rotatable arms and a plurality of nozzles attached to each arm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.