Ball grid array integrated circuit package structure
US6359341B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2000 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Jan 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BGA (Ball Grid Array) integrated circuit package is proposed, which is characterized in the use of a ground metallic layer adhered to a substrate. Moreover, the ground metallic layer can provide the semiconductor chip with a heat-dissipation path, allowing heat from the semiconductor chip during operation to be dissipated to the atmosphere via the ground metallic layer, so that the overall heat-dissipation efficiency can be increased. The ground metallic layer is formed with a chip-receiving cavity for accommodating a semiconductor chip mounted on the substrate. As the semiconductor chip is surrounded and in close proximity to the ground metallic layer, it can help reduce undesired simultaneous switching noise, crosstalk, and electromagnetic interference in the integrated circuit package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.