Tzong-Da Ho
28Patents
13h-index
17Co-inventors
70Inventor score
Filing activity: Jan 21, 2000 → Dec 15, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6507104B2 | Semiconductor package with embedded heat-dissipating device | Electricity | 127 | Expired |
| US6282094A | Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same | Emerging Cross-Sectional Technologies | 117 | Expired |
| US6369455B1 | Externally-embedded heat-dissipating device for ball grid array integrated circuit package | Electricity | 75 | Expired |
| US6444498B1 | Method of making semiconductor package with heat spreader | Electricity | 66 | Expired |
| US6443351B1 | Method of achieving solder ball coplanarity on ball grid array integrated circuit package | Emerging Cross-Sectional Technologies | 57 | Expired |
| US6359341B1 | Ball grid array integrated circuit package structure | Electricity | 55 | Expired |
| US6657296B2 | Semicondctor package | Electricity | 42 | Expired |
| US6458626B1 | Fabricating method for semiconductor package | Electricity | 28 | Expired |
| US6611434B1 | Stacked multi-chip package structure with on-chip integration of passive component | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6469897B2 | Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6451625B1 | Method of fabricating a flip-chip ball-grid-array package with molded underfill | Electricity | 18 | Expired |
| US6650006B2 | Semiconductor package with stacked chips | Electricity | 17 | Expired |
| US6699731B2 | Substrate of semiconductor package | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6844622B2 | Semiconductor package with heat sink | Electricity | 13 | Expired |
| US6306682A | Method of fabricating a ball grid array integrated circuit package having an encapsulating body | Electricity | 12 | Expired |
| US6319750A | Layout method for thin and fine ball grid array package substrate with plating bus | Electricity | 12 | Expired |
| US6867487B2 | Flash-preventing semiconductor package | Electricity | 11 | Expired |
| US6440779B1 | Semiconductor package based on window pad type of leadframe and method of fabricating the same | Electricity | 9 | Expired |
| US6449169B1 | Ball grid array package with interdigitated power ring and ground ring | Electricity | 7 | Expired |
| US7074645B2 | Fabrication method of semiconductor package with heat sink | Electricity | 7 | Expired |
| US6707167B2 | Semiconductor package with crack-preventing member | Electricity | 5 | Expired |
| US6479894B2 | Layout method for thin and fine ball grid array package substrate with plating bus | Electricity | 4 | Expired |
| US6703691B2 | Quad flat non-leaded semiconductor package and method of fabricating the same | Electricity | 4 | Expired |
| USRE39957E1 | Method of making semiconductor package with heat spreader | General | 4 | Expired |
| US7148561B2 | Ball grid array substrate strip with warpage-preventive linkage structure | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.