Method for feeding gases for use in semiconductor manufacturing
US6360762B1 · kind B1 · utility
17Cited by
5References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 22, 2001 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Jan 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87692
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for feeding gases for use in semiconductor manufacturing reduced in size and manufacturing costs and facilitating maintenance and operation of the gas supply system. The apparatus comprises a plurality of gas supply sources, gas source valves provided on the gas lead-out pipes from the respective gas supply sources, flow rate controllers provided on main gas feed pipes into which the lead-out pipes converge, and gas supply valves provided on the outlet side of the flow rate controllers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.