CVD/PVD/CVD/PVD fill process

US6361880B1 · kind B1 · utility

Assignees

• International Business Machines Corporation · US
• Infineon Technologies North America Corp. · US

Inventors

• Larry Clevenger · Lagrangeville, US
• Roy Iggulden · Newburgh, US
• Rainer Florian Schnabel · Weilmünster, DE
• Stefan Weber · Fishkill, US

Key dates

• Filing date: Dec 22, 1999
• Grant date: Mar 26, 2002
• Expiry date: Dec 22, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/2495
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method is provided in which intermediate sized structures can be filled without forming voids during the fill process. The methods involve use of a sequence of CVD/PVD/CVD/PVD steps. The methods are especially effective for filling “intermediate” size features in damascene and dual damascene structures.