Cool frame for protecting packaged electronic devices
US6362522B1 · kind B1 · utility
6Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 10, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Jul 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit arrangement having an integrated circuit package contains an integrated circuit device mounted to a surface of the package. A flat frame is placed on the package surface and substantially surrounds the device. The flat frame has a central opening that receives the integrated circuit device. The height of the flat frame is relative to the height of the circuit device. A heat sink is mounted to the circuit device such that the bottom of the heat sink contacts the upper surface of the integrated circuit device but, does not contact the flat frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.