Apparatus for processing substrate using process solutions having desired mixing ratios
US6363950B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2001 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Aug 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a substrate in which the substrate is successively processed with different kinds of process solution. A spin chuck supports the substrate. A driving source rotates the spin chuck A nozzle member supplies a first process solution prepared by mixing sulfuric acid and a hydrogen peroxide solution at a predetermined mixing ratio to the substrate. A switching mechanism selects the sulfuric acid, the hydrogen peroxide solution and the second process solution supplied to the nozzle member A concentration adjusting mechanism adjusts the ratio of sulfuric acid to the hydrogen peroxide solution, which collectively form the first process solution, supplied to the nozzle member. A control device controls the supply of sulfuric acid, the hydrogen peroxide solution and the second process solution, which is switched by the switching mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.