Chip with internal signal routing in external element
US6365975B1 · kind B1 · utility
173Cited by
65References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1998 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Apr 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/118
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip is provided with a dielectric element having conductive features interconnecting electronic elements within the chip with one another. The conductive features replace internal conductors, and can provide enhanced signal propagation between elements of the chip. The conductive features on the dielectric element are connected to contacts on the chip by deformable conductive elements such as flexible leads so that the dielectric element remains movable with respect to the chip. The dielectric element may have a coefficient of expansion different from that of the chip itself.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.