Multi-layer printed circuit board with signal traces of varying width
US6366466B1 · kind B1 · utility
22Cited by
17References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Mar 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer printed circuit board that includes a first layer and a second layer that have first and second signal traces, respectively. The first signal trace has a relatively thin section and a relatively thick section. The multi-layer printed circuit board also includes a via that couples the first signal trace to the second signal trace. The first signal trace's relatively thin section is located between its relatively thick section and the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.