Closed-loop dome thermal control apparatus for a semiconductor wafer processing system
US6367410B1 · kind B1 · utility
567Cited by
10References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1997 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Oct 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A closed-loop, dome thermal control apparatus containing a high-volume fan, a heat exchange chamber, and an enclosure that encloses the fan and the heat exchange chamber. The fan blows air over a dome of a semiconductor wafer processing system and through the heat exchange chamber to uniformly control the temperature of a dome of a plasma chamber to prevent particle contamination of the wafer. The enclosure recirculates the temperature controlled air to the fan to form a closed-loop apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.