Apparatus for electrochemically processing a microelectronic workpiece
US6368475B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2000 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Mar 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A reactor for use in electrochemical processing of a microelectronic workpiece is set forth and described herein. The apparatus comprises one or more walls defining a processing space therebetween for containing a processing fluid. The processing space includes at least a first fluid flow region and a second fluid flow region. A first electrode is disposed in the processing fluid of the first fluid flow region while a second electrode, comprising at least a portion of the microelectronic workpiece, is disposed in the processing fluid of the second fluid flow region. Fluid flow within the first fluid flow region is generally directed toward the first electrode and away from the second electrode while fluid flow within the second fluid flow region is generally directed toward the second electrode and away from the first electrode. Depending on the particular electrochemical process that is to be executed, the first electrode may constitute either an anode or a cathode in the electrochemical processing of the microelectronic workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.