Method for identifying and controlling impact of ambient conditions on photolithography processes
US6368883B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1999 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Aug 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention is, in its various aspects, a method and apparatus for processing a semiconductor wafer. More particularly, the invention is a method and apparatus for identifying and controlling the impact of ambient conditions on photolithography processes. In a first aspect, the invention is a method for processing a semiconductor wafer. The method comprises identifying a disturbance in a photolithographic process arising from an ambient condition; modeling the identified disturbance; and applying the model to modify a control input parameter. In a second aspect, the invention is an apparatus for controlling a photolithography process. The apparatus includes an exposure tool, including a photolithography controller; and a computer receiving data from the exposure tool. The computer is programmed to perform a method comprising: identifying a disturbance in a photolithographic process arising from an ambient condition; modeling the identified disturbance; and applying the model to modify a control input parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.