Method of manufacturing a semiconductor component and semiconductor component thereof

US6368929B1 · kind B1 · utility

Assignee

• Motorola, Inc. · US

Inventors

• Darrell G. Hill · Tempe, US
• Mariam Sadaka · Austin, US
• Jonathan K. Abrokwah · Tempe, US

Key dates

• Filing date: Aug 17, 2000
• Grant date: Apr 9, 2002
• Expiry date: Aug 17, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D62/85

Abstract

A method of manufacturing a semiconductor component and the component thereof includes forming a dielectric layer (620) over a portion of a passivation ledge (640) in an emitter layer (280) and overlapping a base contact (660) onto the dielectric layer (620).