Externally-embedded heat-dissipating device for ball grid array integrated circuit package
US6369455B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2000 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Apr 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An externally-embedded heat-dissipating device is designed for use with a BGA (Ball Grid Array) IC package for dissipating the IC-produced heat during operation to the atmosphere. that can help further increase the efficiency of heat dissipation from the BGA IC package. The heat-dissipating device is characterized in that it can be externally embedded in the top surface of the encapsulant without having to be supported on the substrate, and also in that it can help reduce the heat path from the IC chip to the heat-dissipating device so that heat-dissipation efficiency can be further increased as compared to the prior art. Further, the heat-dissipating device can help reduce manufacture cycle time and cost and also help prevent delamination, flash, and popcorn effect that would otherwise occur in the case of the prior art. It also can help save layout space over the substrate for compact design of the package. Overall speaking, the proposed heat-dissipating device is more advantageous to use than the prior art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.