CSP BGA test socket with insert and method
US6369595B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1999 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Jan 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A BGA test socket for use in standard testing and burn-in testing of BGA dies and method for testing such dies is disclosed wherein a die contact insert made of silicon or ceramic using standard IC fabrication technology is used. Through using such an insert, even small scale (pitch) BGA dies can be reliably tested including chip scale packaged (“CSP”) BGA dies. Furthermore, using such an insert allows a conventional socket to be adapted for use with a wide variety of both BGA dies and other varieties. A method for using the device is disclosed which overcomes current static electricity problems experienced in testing CSP BGA dies through closing the test socket before removing the die deposit probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.