Multi-chip module and heat-sink cap combination
US6373133B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1999 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Jul 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.