Method and apparatus for monitoring and/or end point detecting a process
US6374150B2 · kind B2 · utility
8Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1998 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Jul 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/712
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention describes a method of end point detecting a process. According to the present invention a surface characteristic is continually measured while the substrate is being processed. A predetermined change in the surface characteristic is utilized a signal and end to the processing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.