Patent · US Expired

Method of manufacturing an enclosed transceiver

US6375780B1 · kind B1 · utility

146Cited by
25References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 4, 2000
Grant dateApr 23, 2002
Priority date
Expiry dateApr 4, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1051
  • WIPO fieldDigital communication
  • WIPO sectorElectrical engineering

Abstract

The present invention teaches a method of manufacturing an enclosed transceiver, such as a radio frequency identification (“RFID”) tag. Structurally, in one embodiment, the tag comprises an integrated circuit (IC) chip, and an RF antenna mounted on a thin film substrate powered by a thin film battery. A variety of antenna geometries are compatible with the above tag construction. These include monopole antennas, dipole antennas, dual dipole antennas, a combination of dipole and loop antennas. Further, in another embodiment, the antennas are positioned either within the plane of the thin film battery or superjacent to the thin film battery.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.