Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
US6376921B1 · kind B1 · utility
83Cited by
17References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1998 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Nov 16, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.