Rotary chemical-mechanical polishing apparatus employing multiple fluid-bearing platens for semiconductor fabrication
US6379216B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A rotary chemical-mechanical polishing apparatus with multiple fluid-bearing platens for use in semiconductor fabrication is described together with a method for chemical-mechanical polishing of semiconductor substrates (“wafers”). A single polishing pad is affixed to a pad backing composed of a thin metal membrane. A polishing fluid is introduced onto an upper surface of the polishing pad. One or more wafers are held face down upon the upper surface of the polishing pad by carriers. Fluid-bearing platens are placed below a lower surface of the pad backing and located directly underneath each wafer. While polishing wafers, the polishing pad and pad backing are rotated about their common center, each carrier and wafer pair is rotated about its common center, the carriers apply a down force on the wafers, and the fluid-bearing platens support the pad backing. The fluid-bearing platens support the pad backing with a fluid flow that exerts a pressure on the pad backing. Within a single fluid-bearing platen, multiple zones of different fluid flow rates allow control of the polishing uniformity. Further, the fluid flow rate distribution of each fluid-bearing platen can be ind…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.