High-speed planarizing apparatus for chemical-mechanical planarization of semiconductor wafers
US6380086B1 · kind B1 · utility
8Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1998 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Aug 11, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a high-speed planarizing machine with a platform that holds the wafer stationary during planarization, and a carrier positioned opposite the platform. The carrier rotates about an axis and translates in a plane that is substantially parallel to the wafer. A polishing pad is attached to the carrier and positioned opposite the wafer. The carrier rotates and translates the polishing pad across the wafer while the wafer is held stationary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.