Treatment for film surface to reduce photo footing
US6380611B1 · kind B1 · utility
37Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1998 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Sep 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved photolithography technique is provided whereby the beneficial effects of using an anti-reflective coating may be realized while maintaining critical dimensions in each subsequent step. This improvement is realized by the treatment of the anti-reflective coating with a gaseous plasma or a solution of sulfuric acid and hydrogen peroxide. By treating the anti-reflective coating with gaseous plasma or solution of sulfuric acid and hydrogen peroxide, no “footing” results and the critical dimensions as set by the photoresist mask are preserved to provide an accurately patterned mask for subsequent steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.