Adaptive endpoint detection for chemical mechanical polishing
US6383058B1 · kind B1 · utility
36Cited by
19References
33Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 28, 2000 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B19/4163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad. A light beam is directed by an optical endpoint detection system to impinge the surface of the substrate. A signal from the optical endpoint detection system is monitored, and if a first endpoint criterion is not detected within a first time window, polishing is stopped at a default polishing time. If the first endpoint criterion is detected within the first time window, the signal is monitored for the second endpoint criterion, and polishing stops if the second endpoint criterion is detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.