Dilute cleaning composition
US6384001B2 · kind B2 · utility
4Cited by
14References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1997 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Mar 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dilute composition for use in semiconductor processing includes both phosphoric acid and acetic acid. Each of the acidic components may be at a concentration of less than about 10% by volume of the dilute composition. The dilute composition can be used for cleaning various surfaces, such as, for example, patterned metal layers and vias by exposing the surfaces to the dilute composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.