Glass-ceramic wiring board
US6384347B1 · kind B1 · utility
1Cited by
17References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2001 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Apr 17, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A glass-ceramic wiring board includes an insulating substrate, a via disposed in the insulating substrate and a via interconnection filling the interior of the via. The via interconnection is sintered material having metal particles. The metal particles have a cross-sectional area per one metal particle surrounded by a metal particle boundary of less than 2000 &mgr;2, which can be determined by cutting, etching and examining a cross-section of the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.