Heat pipe heat sink assembly for cooling semiconductor chips
US6385044B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2001 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Jul 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.