Pad conditioning for copper-based semiconductor wafers
US6387188B1 · kind B1 · utility
1Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1999 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Mar 3, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of conditioning pads used in the polishing of semiconductor wafers containing copper circuitry. The method includes applying a treatment solution that contains a reactant for particulate copper-containing debris on the pad resulting from the copper circuitry. Preferably, the reactant is a carboxylic acid present in a concentration of from about 0.1 to about 10 weight percent in a solution. The pH of the solution may be adjusted to the range from about 1 to about 6 with a compatible base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.