Functional lid for RF power package
US6392298B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Feb 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged integrated circuit device includes a substrate including a first circuit component mounted thereon, a first conductor extending from the first circuit component, and a dielectric lid. The dielectric lid includes a component mounting surface, a second circuit component mounted on the component mounting surface, and a second conductor extending from the second circuit component. The dielectric lid is adapted to engage with the substrate such that the first circuit component is in electrical communication with the second circuit component. The second circuit component may comprises an impedance matching circuit. The circuit device may also include fastening means for securing the lid to the substrate. The fastening means may comprise an adhesive, solder, or a spring biased member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.