Dual orientation leveling platform for semiconductor apparatus
US6394440B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Jul 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A platform is held atop a vertically moveable dual position leveling base by three draw screws, three push screws, and three spring-loaded pins. The leveling base is configured to secure and orient the platform such that an upper surface of the platform is substantially horizontal with allowance for adjustments in each of two positions. The platform is pushed upwardly relative to the base by the spring-loaded pins. The orientation of the platform in one position is adjusted by the three draw screws, which pull the platform down against the upward force of the spring-loaded pins. The base also has an upper position in which the platform is pressed into sealing engagement with a lower mating surface of a chamber. Three adjustable push screws provide the desired platform orientation by limiting the movement of the platform towards the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.