Conductive mesh bias connection for an array of elevated active pixel sensors
US6396118B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Feb 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/206
Abstract
An array of active pixel sensors includes a substrate. An interconnect structure is formed adjacent to the substrate. The interconnect structure includes a plurality of conductive vias. A plurality of photo sensors are formed adjacent to the interconnect structure. Each photo sensor includes a pixel electrode. Each pixel electrode is electrically connected to the substrate through a corresponding conductive yet. A I-layer is formed over each of the pixel electrodes. The array of active pixel sensors further includes a conductive mesh formed adjacent to the photo sensors. An inner surface of the conductive mesh is electrically and physically connected to the photo sensors, and electrically connected to the substrate through a conductive via. The conductive mesh providing light shielding between photo sensors thereby reducing cross-talk between the photo sensors. The conductive mesh includes apertures that align with at least one of the pixel electrodes of the photo sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.